Our common processing methods in electronic product processing are smt patch assembly and dip plug-in processing. The two are indispensable, both of which play the role of welding between components and PCB, which shows the importance of smt patch assembly and dip plug-in processing. So what are the main differences between smt patch assembly and dip plug-in processing?
1. SMT patch assembly
SMT patch assembly refers to surface assembly technology, which is a popular technology and process in the electronic assembly industry. Its basic process includes solder paste printing, chip assembly, reflow soldering, optical inspection, etc.; SMT chip assembly uses chip components, which have high reliability, small size, light weight, strong vibration resistance, and automatic production , High installation reliability, high welding quality pass rate. At present, nearly 90% of electronic products are soldered using SMT chip assembly process.
2. Dip plug-in processing
dip plug-in processing is also called dual-in-line packaging technology, and its basic process includes component molding processing, plug-in, wave soldering, component leg cutting, repair welding (post-welding), board washing, etc.; The good components are inserted into the corresponding hole position of the PCB board, and then the inserted PCB board is put into the wave soldering conveyor belt, after spraying flux, preheating, and finally through the wave crest to form welding between the PCB board and the components.
3. The difference between the two
- 1. The smt chip assembly is to mount the components on the PCB board through the chip mounter, and then reflow soldering to form an electrical mechanical connection. 95% of the processing procedures are completed by mechanical equipment;
- 2. The dip plug-in processing technology is after the smt patch assembly process. The dip plug-in is to insert the components into the PCB board hole with the dip structure. The dip plug-in includes manual plug-in and AI plug-in. Due to the development of smt, there are relatively few dip plug-in processing components, so many factories generally use assembly line manual plug-in, and the number of employees required is relatively large. 30% of its processing procedures are completed by mechanical equipment;
SMT patch assembly and dip plug-in processing have their own characteristics, but the two complement each other to form a complete process of electronic product processing and production. With the rapid development of smt technology, smt chip assembly gradually replaces the trend of dip plug-in processing, but due to the performance requirements of electronic products, plug-in processing has not been completely replaced, and still plays an important role in the processing of electronic products.